FPC Parameters

Item

Parameter

 Min. Line Width

3mil

 Min. Line Spacing

3mil

 Min. Annular Ring Width

4mil

 Min. Hole Diameter

0.3mm

 No. of Layers

1-6 

 Copper Thickness

18um35um50um70um105um

Base Material

Polyimide

25um35um50um

Polyester

25um50um75um100um

Max. Board Size

  DS

500×500mm

MLB

500×500mm

Hole Dia. Tolerance

NPTH

±0.05mm

PTH

±0.08mm

Outline Tolerance

±0.1mm

PTH Wall Copper Thickness

0.025mm

Insulation Resistance

1011ΩNormal

Peel off Strength

1.0N/mm

Thermal Shock Resistance

260 10 (260 10 seconds)

Flammability Rate

94V-0

Test Voltage

10V-250V

Quality Standard

IPC600F


MLB Parameters

Item

Parameter

Min. Line Width

0.1mm

Min. Line Spacing

0.1mm

Min. Annular Ring Width

0.1mm

Min. Hole Diameter

0.2mm

No. of Layers

1-20

Base Material

DS

0.2mm-3.0mm

MLB

0.45mm-6.0mm

Board Size

DS

600×800mm

MLB

550×800mm

Hole Dia.Tolerance

NPTH

±0.05mm

PTH

±0.076mm

Hole to Hole Tolerance

±0.076mm

Outline Tolerance

±0.13mm

PTH Wall Copper Thickness

0.025mm

Insulation Resistance

1012Ω(Normal

Peel off Strength

1.4N/mm

Thermal Shock Resistance

260 20 (260 20 Seconds)

Solder Mask Hardness

6H

Flammability Rate

94V-0

Test Voltage

10V-250V

Warp and Twist

1%

Quality Standard

GB4588.2; GB4588.4; IPC600E





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